Internship: Photonic Integrated Circuits Characterisation
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Internship: Photonic Integrated Circuits Characterisation at Quandela: Massy, Francia; Presencial; Jornada completa; Ingeniería, manufactura y construcción. JobGrid adds normalized role facts, source context, and a path to the employer application page so candidates can compare the listing before applying.
- Location and workplace: Massy, Francia, Presencial
- Role classification: Ingeniería, manufactura y construcción, Jornada completa
- Source freshness: checked by JobGrid on 2026-05-30.
- Application path: candidates continue to the employer application page with non-personal referral tags.
About Quandela:
Quandela stands as a global leader in quantum computing, driven by groundbreaking technology and a strategic vision for scaling quantum solutions. The company’s unique ability to offer both hardware and software solutions, along with its commitment to build energy efficient datacentres and scalability, positions it to play a key role in the next wave of innovation, and in many strategic and sovereign industrial sectors.
Join Us at the Forefront of Quantum Computing Innovation 🚀
Description of the Team
This internship will take place within the Photonic Integrated Circuits (PIC) team at Quandela. The team works on the production and development of optical processors used in Quandela's QPUs, playing a central role in their performance and scalability.
The PIC team covers several aspects of photonic chip development. Part of the team focuses on the design of next-generation PICs, typically carrying out electromagnetic and thermal simulations and preparing layouts for fabrication in collaboration with external foundries. Simultaneously, the team continuously improves upon previous photonic building blocks through iterative fabrication and in-house characterisation.
Characterisation is a critical activity at multiple points in the PIC production process: evaluating individual components, validating production-ready chips (both electrically and optically) and testing them post-packaging. The characterisation team also typically perform the optical packaging required to connect the chip to the rest of the QPU.
This internship will be focused on the characterisation activities of the PIC team, directly contributing to the evaluation and optimisation of photonic components and systems.
Your Key Responsibilities
Depending on your prior experience and the duration of the internship, you can expect to be involved in some of the following activities:
- Optical measurement of PICs using standard bulk-optics and fibre components, manual and motorised stages, CW lasers, polarisation control and driving electronics
- Electrical probing of PICs using DC and RF probes
- Optical packaging of PICs
- Python scripting for measurement automation and data analysis
- CAD design for fabrication of mechanical pieces to complement the existing setups
- Development of electronics for equipment control