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Industry Product Specialist（Semiconductor Packaging Technology）

🇸🇬 Singapore, SG Presencial Publicado Abr 24, 2026

LocalizaçãoSingapore, SG

ModalidadePresencial

Publicado24 de Abril de 2026

Última verificação7 de Maio de 2026

Position Overview Provide professional support for technical deconstruction, process knowledge graph construction, and product evaluation in the advanced packaging domain, with focus on 2.5D/3D packaging, TSV (Through-Silicon Via), and Hybrid Bonding.